I am an Advanced Packaging Engineer at Intel, passionate about solving complex engineering challenges at the intersection of robotics, mechanical design and advanced manufacturing.
I hold a degree in Mechanical Engineering from the University of California, Los Angeles, with a focus on Robotics and Control. Previously, I interned for a year at NASA’s Jet Propulsion Laboratory (JPL), where I contributed to the design of electro-mechanical systems engineered to survive the harsh environments of space, helping advance our understanding of the origins of water in the solar system.
During my time at UCLA, I also served as a Teaching Assistant in statistics, working alongside distinguished faculty members including Alan Garfinkel, Jane Shevstov, Morgan Tingley, and Kristin McCully - an experience that deepened my love for education and mentorship. I continue to give back as a UCLA Alumni Mentor and was honored with a Distinguished Alumni Mentor Award.
I am originally from Ara, Bihar, a region with one of India’s highest illiteracy rates - a background that has shaped my unwavering belief in the transformative power of education. I hope to inspire the next generation of engineers and scientists, particularly from underserved communities.
I know it sounds sappy but I want to change the world.
News
2025
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UCLA Alumni Distinguished Mentor Award
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Y combinator AI Start UP School
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Invited talk, SWE UCLA
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Judged LA Hacks
2024
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Started working for Intel
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Judged LA hacks
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Graduated from UCLA!
2023
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Granted Indian Design Patent for Medico - An automated robot
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Started working for NASA!
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Awarded NASA-JPL Fellowship
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Invited talk, VIT robotics club
2022
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Invited Talk, VIT Aumni Association
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Joined ROMELA as a volunteer student researcher
2021
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Awarded Teaching fellowship at UCLA
Publications
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A UAV based CMOS Ku-band metasurface FMCW radar system for low-altitude snowpack sensing, Adrian Tang, Nacer Chahat, Yangyho Kim, Arhison Bharathan, Gabriel Virbila, Hans-Peter Marshall, Thomas Van Der Weide, Gaurangi Gupta, Raunika Anand, Goutam Chattopadhyay, Mau-Chung Frank Chang, IEEE Journal of Microwaves

